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Items for Author "Yi-Ming Jen" 

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Showing 9 items.

Collection Date Title Authors Bitstream
[機械與機電工程學系] 演講及研討會 2003 Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging application Chia-Tai Kuo; Ming-Chuen Yip; Kuo-Ning Chiang; Yi-Ming Jen
[機械與機電工程學系] 期刊論文 2018 Combined Temperature and Moisture Effect on the Monotonic and Fatigue Strengths of Sandwich Beams with Glass-Polypropylene Faces and Aluminum Foam Cores Yi-Ming Jen; Chia-Wei Chang
[機械與機電工程學系] 期刊論文 2014-02 Two-Stage Cumulative Bending Fatigue Behavior for the Adhesively Bonded Aluminum Honeycomb Sandwich Panels Yi-Ming Jen; Fu-Lung Teng; Ta-Cheng Teng
[機械與機電工程學系] 期刊論文 2013 Effect of Temperature on Fatigue Strength of Carbon Nanotube/Epoxy Composites Yi-Ming Jen; Chien-Yang Huang
[機械與機電工程學系] 期刊論文 2012-06 Stress concentration effect on the fatigue properties of carbon nanotube/epoxy composites Yi-Ming Jen; Yung-Chuan Wang; 任貽明
[機械與機電工程學系] 期刊論文 2012-03 Fatigue life evaluation of adhesively bonded scarf joints Yi-Ming Jen; 任貽明
[機械與機電工程學系] 期刊論文 2011-03 Experimental investigation on the effect of tensile pre-strain on ratcheting behavior of 430 Stainless Steel under fully-reversed loading condition Yung-Chuan Chiou; Yi-Ming Jen; Wen-Kai Weng
[機械與機電工程學系] 期刊論文 2011-03 Fracture mechanics study on the intermetallic compound cracks for the solder joints of electronic packages Yi-Ming Jen; Yung-Chuan Chiou; Chen-Li Yu
[機械與機電工程學系] 期刊論文 2008 The influence of shot peening induced residual stress on post-necking behavior of tempered ultrahigh strength low alloy 300M steel Yu-Cyuan Lin; Bee-Fong Wu; Yi-Ming Jen; Shing-Hoa Wang; Hsiu-Chuan Hsu; Ji-Jung Yeh

 


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