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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/52780

Title: L- and U-shaped heat pipes thermal modules with twin fans for cooling of electronic system under variable heat source areas
Authors: Jung-Chang Wang
Contributors: 國立臺灣海洋大學:輪機工程學系
Keywords: Thermal Resistance
Heat Sink
Heat Pipe
Base Plate
Thermal Performance
Date: 2014-04
Issue Date: 2020-01-06T07:58:44Z
Publisher: Heat and Mass Transfer
Abstract: Abstract: This study utilizes a versatile superposition method with thermal resistance network analysis to design and experiment on a thermal module with embedded six L-shaped or two U-shaped heat pipes and plate fins under different fan speeds and heat source areas. This type of heat pipes-heat sink module successively transfer heat capacity from a heat source to the heat pipes, the heat sink and their surroundings, and are suitable for cooling electronic systems via forced convection mechanism. The thermal resistances contain all major components from the thermal interface through the heat pipes and fins. Thermal performance testing shows that the lowest thermal resistances of the representative L- and U-shaped heat pipes-heat sink thermal modules are respectively 0.25 and 0.17 °C/W under twin fans of 3,000 RPM and 30 × 30 mm2 heat sources. The result of this work is a useful thermal management method to facilitate rapid analysis.
Relation: 50(11) pp 1487–1498
URI: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/52780
Appears in Collections:[輪機工程學系] 期刊論文

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