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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/52778

Title: Optimization of Heat Flow Analysis for Exceeding Hundred Watts in HI-LEDs Projectors
Authors: Rong-TsuWang
Contributors: 國立臺灣海洋大學:輪機工程學系
Keywords: Heat sink
Metal-core printed circuit board (MCPCB)
Vapor chamber (VC)
Date: 2015-10
Issue Date: 2020-01-06T07:27:58Z
Publisher: International Communications in Heat and Mass Transfer
Abstract: Abstract: This study conducted a heat flow-lighting performance test to evaluate and analyze an exceeding hundred watts of HI-LEDs (higher-power LEDs) projector. In addition, a Windows-based optimization program was developed to optimize the heat sink of the HI-LEDs projector. The results indicated that the maximal LED temperature of the projector was 108 °C at a steady temperature state (approximately 1 h of operation). When the metal-core printed circuit board (MCPCB) of the projector was replaced with a vapor-chamber PCB (VCPCB), the LED temperature decreased to 87.6 °C. Iterative calculations were subsequently performed using the self-developed Windows-based optimization program for determining the optimal fin interval (8.94 mm) and thickness (2.56 mm). These optimal parameters were simulated using CFD (computational fluid dynamics), and the results were compared with those of the original 150-W HI-LEDs projector. A Rayleigh number of 6.1304 × 105 was obtained, indicating a laminar flow model. When the optimized heat sink was used, the LED temperatures for the MCPCB and VCPCB HI-LEDs projector samples decreased by 14 and 9.74 °C, respectively. The h value of the optimized HI-LEDs projector (8.094 W/m2k) was higher than that of the original HI-LEDs projector (7.154 W/m2k), and its weight was reduced by approximately 2%.
Relation: 67: pp 153-162
URI: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/52778
Appears in Collections:[輪機工程學系] 期刊論文

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