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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/52774

Title: Analysis of Thermal Conductivity in HI-LEDs Lighting Materials
Authors: Rong-Tsu Wang
Jung-Chang Wang
Keywords: Composite material
Heat conduction coefficient
Metal material
One-dimensional transient conduction analysis
Steady-state conduction analysis
Date: 2017-06
Issue Date: 2020-01-06T06:58:32Z
Publisher: Journal of Mechanical Science and Technology
Abstract: Abstract: The present study devised a measurement system to estimate the thermal conductivity of electronic product materials, especially in HILEDs lighting materials, exhibiting distinct thermal characteristics by conducting thermal performance experiments and theoretical analyses. First, steady-state conduction analysis with thermal resistance method was investigated on three composite material substrates of unknown heat conduction coefficients through a substrate material named Bakelite of low thermal conductivity revealing stable quality. Second, one-dimension semi-infinite transient conduction analysis was utilized to investigate metal materials with high thermal conductivities. Results showed that the Bakelite experimental module was verified for 62.5 % of the original wattages, which closest to the thermal conductivity 0.233 W/m-K of the Bakelite. And these composite materials M1, M2 and M3 composed of polymer and epoxy were 1.311, 0.844 and 2.403 W/m-K, respectively. The thermal performance experiments were investigated and the results have proved the correctness of the theoretical model. According to the experimental results, calculating the temperature value of the metal materials comprising cotton insulation and the transient analysis, this study determined the temperature error to be less 20 %. Consequently, a transient measurement system and method for metal materials with high heat conduction coefficients was established. Finally, the results of this work are the useful thermal conductivity method to facilitate rapid analysis in the future.
Relation: 31(6) pp 2911–2921
URI: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/52774
Appears in Collections:[輪機工程學系] 期刊論文

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