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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/52289

Title: Residual Stress Image Inspections based on Bending Testing for Flexible Transparent Conducting Substrates by Single-direction Common-path Image Interferometry
Authors: Bor-Jiunn Wen
Shih-An Huang
Contributors: 國立臺灣海洋大學:機械與機電工程學系
Keywords: Substrates
Residual stresses
Optical imaging
Optical films
Date: 2019-03
Issue Date: 2019-06-21T07:56:47Z
Publisher: IEEE Sensors Journal
Abstract: Abstract: This paper proposes a method for automatic inspection of residual stress images based on bending testing for flexible transparent conducting substrates. A flexible characteristics inspection system with single-direction common-path image interferometry is utilized to inspect residual stress images automatically during the bending testing operation. Accordingly, a 5 × 5 cm 2 residual stress image of a 203-μm line pattern on a conducting Indium tin oxide (ITO) film deposited on Polyethylene terephthalate (PET) substrate with up to 11000 bending cycles is inspected and analyzed. The relationship between the residual stresses and resistance characteristics of the 203-μm line pattern on the ITO-deposited-on-PET substrate based on bending testing is also analyzed. It was found that the change results of the residual stress can predict the resistance characteristics of the ITO-deposited-on-PET substrate sufficiently. Therefore, the inspection results of residual stress images depicted on flexible electronics may help designers and manufacturers to develop products and ensure quality control, respectively, in a manufacturing process.
Relation: 19(5) pp.1701-1709
URI: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/52289
Appears in Collections:[機械與機電工程學系] 期刊論文

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