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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/51821

Title: Crack-free micromachining on glass using an economic Q-switched 532 nm laser
Authors: Ji-Yen Cheng
Meng-Hua Yen
Tai-Horng Young
Contributors: 國立臺灣海洋大學:機械與機電工程學系
Date: 2006-09
Issue Date: 2018-12-25T07:41:21Z
Publisher: Journal of Micromech. Microeng.
Abstract: Abstract: Laser-induced backside wet etching (LIBWE) is an effective method for crack-free etching of transparent materials such as glass and quartz. Traditionally, LIBWE is performed using ultraviolet (UV) laser sources. However, this study describes the use of an economic Q-switched 532 nm green laser in the LIBWE microfabrication of sodalime glass substrates. Using a common organic dye (Rose Bengal) as the photoetchant, crack-free microstructures with a minimum feature size of 18 µm are obtained. The typical etch rate is approximately 10 to 70 nm/pulse and the maximum attainable depth is found to be approximately 65 µm. The etch threshold is 5.7 J cm−2. The surface quality of the micro-trenches produced by the visible LIBWE source is comparable to that obtained in the traditional UV LIBWE process. Microtrenching in sodalime is demonstrated to show the feasibility of microfluidic chip development using visible LIBWE.
Relation: 16(11)
URI: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/51821
Appears in Collections:[機械與機電工程學系] 期刊論文

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