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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/50281

Title: Microfluidic chip fabrication using hot embossing and thermal bonding of COP
Authors: Boe‐Yu Pemg
Chih‐Wei Wu
Yung‐Kang Shen
Yi Lin
Contributors: 國立臺灣海洋大學:機械與機電工程學系
Keywords: microfluidic chip
surface roughness
bonding strength
Date: 2010-07
Issue Date: 2018-09-28T06:04:27Z
Publisher: Polym. Adv. Technol
Abstract: Abstract: The application of silicon mold inserts by micro‐hot embossing molding has been explored in microfluidic chip fabrication. For the mold insert, this study employed an SU‐8 photoresist to coat the silicon wafer. Ultraviolet light was then used to expose the pattern on the SU‐8 photoresist surface. This study replicates the microstructure of the silicon mold insert by micro‐hot embossing molding. Different processing parameters (embossing temperature, embossing pressure, embossing time, and de‐molding temperature) for the cycle‐olefin polymer (COP) film of microfluidic chips are evaluated. The results showed that the most important parameter for replication of molded microfluidic chip is embossing temperature. De‐molding temperature is the most important parameter for surface roughness of the molded microfluidic chip. The microchannel is bonded with a cover by thermal bonding processing to form the sealed microfluidic chip. The bonding temperature is the most important factor in the bonding strength of the sealed microfluidic chip. Copyright © 2009 John Wiley & Sons, Ltd.
Relation: 21(7) pp.457-466
URI: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/50281
Appears in Collections:[機械與機電工程學系] 期刊論文

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