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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/50017

Title: Layer-aware 3D-IC partitioning for area-overhead reduction considering the power of interconnections and pads
Authors: Lai, Yung-Hao
Chang, Yang-Lang
Fang, Jyh-Perng
Chang, Lena
Kobayashi, Hirokazu
Contributors: 國立臺灣海洋大學:通訊與導航工程系
Date: 2016-06
Issue Date: 2018-09-07T06:01:29Z
Publisher: IEICE Trans. on Fundamental of Electronics, Communications and Computer Sciences
Relation: (6) pp.1206-1215
URI: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/50017
Appears in Collections:[通訊與導航工程學系] 期刊論文

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