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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/48216

Title: TiN coatings on mild steel substrates with electroless nickel as an interlayer
Authors: Yung-I Chen
Jenq-Gong Duh
Contributors: 國立臺灣海洋大學:光電與材料科技學系
Date: 1991-11
Issue Date: 2018-08-16T06:19:15Z
Publisher: Surface and Coatings Technilogy
Abstract: Abstract: Electroless nickel deposits are incorporated as an interlayer between TiN coatings and mild steel substrates. The electroless nickel layer recrystallizes during r.f. sputtering and a coating assembly of TiN/Ni3/Fe is formed. The employment of electroless nickel results in an increase in the surface hardness as well as the adhesion strength. A Knoop surface hardness as high as 2120 HK5 (close to the hardness of bulk TiN) can be achieved in the interlayer-modified TiN coating.
Relation: 48(2) pp.163-168
URI: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/48216
Appears in Collections:[光電科學研究所] 期刊論文

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