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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/48215

Title: Thermal Stability and Mechanical Properties of Ni-W-P Electroless Deposits
Authors: Y.Y.Tsai
Contributors: 國立臺灣海洋大學:光電與材料科技學系
Date: 2001-10
Issue Date: 2018-08-16T06:12:28Z
Publisher: Surface and Coatings Technology
Abstract: Abstract: The ternary Ni–W–P alloy coatings were deposited by electroless plating on 420 stainless steel to evaluate the thermal property and related mechanical characteristics of the coating assemblies. The thermal stability of electroless Ni–W–P deposits, analyzed by differential scanning calorimetry (DSC), could be enhanced by the co-deposition of tungsten as compared to binary electroless Ni–P films. The phase and composition of Ni–W–P and Ni–P were evaluated by X-ray diffraction technique and electron probe microanalysis, respectively. The co-deposition of tungsten enabled the deposits to exhibit an amorphous structure with lower phosphorus content. Adhesion strength of the deposits on the substrates were assessed by a scratch test. The introduction of the tungsten in the Ni–P coating effectively reduced the linear crack length and delayed the cracking formation. Surface hardness of binary alloy coating could be modified with the introduction of the tungsten element.
Relation: 146-147 pp.502-507
URI: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/48215
Appears in Collections:[光電科學研究所] 期刊論文

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