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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/47351

Title: Localized Electrochemical Deposition of Copper Monitored Using Real-Time X-ray Microradiography
Authors: Jung-Ho Je
Seung-Kwon Seol
Ah-Ram Pyun
Yeukuang Hwu
Giorgio Margaritondo
Contributors: 國立臺灣海洋大學:光電科學研究所
Keywords: Electrochemical deposition, localized
Copper
Microradiography
Microstructures, metal
Date: 2005-02
Issue Date: 2018-07-16T08:22:52Z
Publisher: Adv. Func. Mater.
Abstract: Abstract: We have developed a novel strategy for localized electrochemical deposition (LECD) to improve both the lateral resolution of the process and the porosity of the fabricated high‐aspect‐ratio microstructures. The strategy is based on accurately controlling the motion of the anode. Its implementation is made possible by the use of coherent, synchrotron X‐ray microradiography with high time and lateral resolution, enabling the observation of the copper LECD process in real time. Microradiography reveals a deposition mechanism that differs as a function of the distance between the electrode (anode) and the growing structure (cathode). Specifically, the interplay of migration and diffusion of the metal ions in the baths affects the deposition rate and the characteristics of the fabricated structure. This enables us to optimize the anode motion control and greatly improve the quality of the structure grown.
Relation: 15(6) pp.934-937
URI: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/47351
Appears in Collections:[光電科學研究所] 期刊論文

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