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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/47286

Title: Dynamical growth behavior of copper clusters during electrodeposition
Authors: G. Margaritondo
Pei-Cheng Hsu
Yong Chu
Jae-Mock Yi
Cheng-Liang Wang
Syue-Ren Wu
Y. Hwu
Contributors: 國立臺灣海洋大學:光電科學研究所
Date: 2010-07
Issue Date: 2018-07-10T02:58:04Z
Abstract: ABSTRACT: Ultrahigh resolution full-field transmission x-ray microscopy enabled us to observe detailed phenomena during the potentiostatic copper electrodeposition on polycrystalline gold. We detected two coexisting cluster populations with different sizes. Their growth behaviors are different, with a shape transitions only occurring for large clusters. These differences influence the micromorphology and general properties of the overlayer.
Relation: 97(3)
URI: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/47286
Appears in Collections:[光電科學研究所] 期刊論文

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