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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/37757

Title: A Novel Micro-Scale Recombining Technique Using Lateral Joining for A Large-Area Molding with Small Features
Authors: Chih-Wei Wu;Long-Sun Huang;Jer-Haur Chang;Sen-Yeu Yang;Chih-Kung Lee
Contributors: 國立臺灣海洋大學:機械與機電工學系
Date: 2003
Issue Date: 2016-05-03T03:15:23Z
Publisher: Sensors and Actuators A: Physical
URI: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/37757
Appears in Collections:[機械與機電工程學系] 期刊論文

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