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题名: L-type heat pipes application in electronic cooling system
作者: Jung-Chang Wang
贡献者: 國立臺灣海洋大學:輪機工程學系
关键词: Embedded L-shaped heat pipes;Thermal resistance;Superposition method;Thermal performance
日期: 2011-01
上传时间: 2012-06-18T06:00:02Z
出版者: International Journal of Thermal Sciences
摘要: Abstract:This paper describes the design, modeling, and test of a heat sink with embedded L-shaped heat pipes and plate fins. This type of heat sink is particularly well suited for cooling electronic components such as microprocessors using forced convection. The mathematical model includes all major components from the thermal interface through the heat pipes and fins. It is augmented with measured values for the heat pipe thermal resistance. A Windows-based computer program uses an iterative superposition method to predict the thermal performance. Thermal performance testing shows that a representative heat sink with six heat pipes will carry 160 W and has reached a minimum thermal resistance of 0.22 °C/W. The computer software predicted a thermal resistance of 0.21 °C/W, which was within 5% of the measured value. The result of this work is a useful thermal management device along with a validated computer-aided tool to facilitate rapid design.
關聯: 50(1), pp.97–105
显示于类别:[輪機工程學系] 期刊論文


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