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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/32094

Title: Misalignment Inspection of Multilayer PCBs with an Automated X-Ray Machine Vision System
Authors: Shui-Fa Chuang;Wen-Tung Chang;Chih-Cheng Lin;Yeong-Shin Tarng
Contributors: NTOU:Department of Mechanical and Mechatronic Engineering
國立臺灣海洋大學:機械與機電工程學系
Keywords: Multilayer printed circuit board (PCB);Layer-to-layer misalignment;Misalignment inspection;X-ray image;Machine vision;Image processing;Mechatronics system
Date: 2010-12
Issue Date: 2012-06-15T07:21:21Z
Publisher: The International Journal of Advanced Manufacturing Technology
Abstract: Abstract:In recent times, multilayer printed circuit boards (PCBs) have been extensively applied in the electronics industry owing to their high capacities for complex and densely packed circuit layouts arranged in a limited space. The inspection of fabricated multilayer PCBs is thus important in order to ensure quality control and improve the fabrication process. In this paper, an automated X-ray machine vision system was developed exclusively for the inspection of the layer-to-layer misalignment of laminated multilayer PCBs. Based on a mechatronics system and X-ray image processing techniques, an automated misalignment inspection process was established. Experiments meant to inspect three critical layer-to-layer misalignment modes, expansion, contraction, and offset, found within ten-layer PCB samples, were conducted to test the feasibility of the developed machine inspection system. The experimental results show that the developed X-ray machine vision system, combined with the automated misalignment inspection process, was able to undertake misalignment inspection of certain multilayer PCBs.
Relation: 51(9-12), pp.995-1008
URI: http://ntour.ntou.edu.tw/handle/987654321/32094
Appears in Collections:[機械與機電工程學系] 期刊論文

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