English  |  正體中文  |  简体中文  |  Items with full text/Total items : 27005/38806
Visitors : 2402917      Online Users : 77
RC Version 4.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Adv. Search

Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/32077

Title: Finite Element Based Fatigue Life Estimation of the Solder Joints with Effect of Intermetallic Compound Growth
Authors: Chiou;Yung-Chuan;Jen;Yi-Ming;Huang;Shih-Hsiang
Contributors: NTOU:Department of Mechanical and Mechatronic Engineering
Date: 2011-12
Issue Date: 2012-06-15T07:21:11Z
Publisher: Microelectronics Reliability
Abstract: Abstract:This paper develops an analysis procedure to study the effects of intermetallic compound (IMC) growth on the fatigue life of 63Sn–37Pb (lead-rich)/96.5Sn–3.5Ag (lead-free) solder balls for flip-chip plastic ball grid array packages under thermal cycling test conditions. In this analysis procedure, the thickness of the IMC increased with the number of thermal cycles, and was determined using the growth rate equation. A series of non-linear finite element analyses was conducted to simulate the stress/strain history at the critical locations of the solder balls with various IMC thicknesses in thermal cycling tests. The simulated stress/strain results were then employed in a fatigue life prediction model to determine the relationship between the predicted fatigue life of the solder ball and the IMC thickness. Based on the concept of continuous damage accumulation and incorporated with the linear damage rule, this study defines the damage of each thermal cycle as the reciprocal of the predicted fatigue life of the solder joints with the corresponding IMC thickness. The final fatigue failure of the solder ball was determined as the number of cycles corresponding to the cumulative damage equal to unity. Results show that the solder joint fatigue life decreased as the IMC thickness increased. Moreover, the predicted thermal fatigue life of lead-rich solders based on the effects of IMC growth is apparently smaller than that without considering the IMC growth in the reliability analysis. Results also show that the influence of the IMC thickness on the fatigue life prediction of the lead-free solder joint can be ignored.
Relation: 51(12), pp.2319-2329
URI: http://ntour.ntou.edu.tw/handle/987654321/32077
Appears in Collections:[機械與機電工程學系] 期刊論文

Files in This Item:

There are no files associated with this item.

All items in NTOUR are protected by copyright, with all rights reserved.


著作權政策宣告: 本網站之內容為國立臺灣海洋大學所收錄之機構典藏,無償提供學術研究與公眾教育等公益性使用,請合理使用本網站之內容,以尊重著作權人之權益。
網站維護: 海大圖資處 圖書系統組
DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback