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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/26339

Title: Vapor Chamber in High Performance Server
Authors: Jung-Chang Wang;Teng-Chieh Chen
Contributors: 國立臺灣海洋大學:輪機工程學系
Date: 2009-10-21
Issue Date: 2011-10-20T08:34:54Z
Publisher: Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Abstract: Abstract:This article describes how to evaluate the thermal-performance of vapor chamber-based thermal module, which has existed in the thermal-module industry for a year or so especially in server application. Thermal-performance of the thermal module with the vapor chamber can be determined within several seconds by using the final formula associated with thermal-performance experimental method deduced in this paper. From the results, the thermal performance of the vapor chamber thermal module is times than that of pure copper base plate. And its thermal performance is closely relate to its dimensions and heat-source flux, in the case of small-area vapor chamber and small heat-source flux, the thermal performance will be less than that of pure copper material. The maximum heat flux of the vapor chamber is over 800,000 W/m2, its thermal performance will increase with input power increasing, and the calculating error is no more than ±3%.
Relation: pp.364-367
URI: http://ntour.ntou.edu.tw/handle/987654321/26339
Appears in Collections:[輪機工程學系] 演講及研討會

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