English  |  正體中文  |  简体中文  |  Items with full text/Total items : 26994/38795
Visitors : 2386847      Online Users : 37
RC Version 4.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Adv. Search

Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/26243

Title: Heat pipe for cooling of electronic equipment
Authors: Yu-Wei Chang;Chiao-Hung Cheng;Jung-Chang Wang;Sih-Li Chen
Contributors: 國立臺灣海洋大學:輪機工程學系
Keywords: Thermal resistance;Thermal performance;Heat pipe;Flooding phenomenon
Date: 2008-11
Issue Date: 2011-10-20T08:34:33Z
Publisher: Energy Conversion and Management
Abstract: Abstract:This article experimentally investigates the thermal performance of the heat pipe cooling system with the thermal resistance model. Evaporator and condenser, which are the two main devices, connect to each other to form a closed system. The liquid water absorbs heat from heat source and evaporates in the evaporator. The evaporating fluid moves toward the condenser, and then condenses in the condenser. The experimental parameters are different evaporation surfaces, fill ratios of working fluid and input heating powers. The result shows that the evaporation resistance and the condensation resistance both grow with increasing heating power and decreasing fill ratio. Flooding is found at the fill ratio of 20% with the evaporation surface noted Etched Surface 2 when heating power is above 120 W. Flooding phenomenon is caused by the opposite flow direction of vapor and liquid in a closed two-phase system. According to the result, the lowest total thermal resistance is 0.65 °C/W by the evaporation surface noted Etched Surface 2 at 30% fill ratio.
Relation: 49(11), pp.3398–3404
URI: http://ntour.ntou.edu.tw/handle/987654321/26243
Appears in Collections:[輪機工程學系] 期刊論文

Files in This Item:

File Description SizeFormat

All items in NTOUR are protected by copyright, with all rights reserved.


著作權政策宣告: 本網站之內容為國立臺灣海洋大學所收錄之機構典藏,無償提供學術研究與公眾教育等公益性使用,請合理使用本網站之內容,以尊重著作權人之權益。
網站維護: 海大圖資處 圖書系統組
DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback