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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/23929

Title: 直立式嵌入熱管散熱模組性能實驗與個人電腦熱流場數值模擬
Experiments on the Performance of Upright Heat Modules Embedded with Heat Pipes and Numerical Simulation on the Flow and Thermal Fields in Personal Computers
Authors: 邱永凌;田華忠通訊作者
Contributors: NTOU:Department of Mechanical and Mechatronic Engineering
Keywords: 個人電腦;散熱模組;熱管
Personal computers;CPU coolers;heat pipes;FLOTHERM
Date: 2008-11
Issue Date: 2011-10-20T08:08:46Z
Publisher: 中華民國機械工程學會第二十五屆全國學術研討會
Abstract:  本論文主要分為三個部分,第一部分是以實驗方式比較不同形式散熱模組之散熱效果,其中包括方形散熱模組、輻射狀散熱模組以及直立式嵌入熱管散熱模組,再藉由模擬軟體FLOTHERM V6.1之分析來觀察熱流場的變化。第二部分則是將輻射狀散熱模組以及直立式嵌入熱管散熱模組,分別置入電腦之中,觀察電腦內部熱流場的變化,並比較整體散熱效率。最後則嘗試以數種方式改良內部的熱流場以增加散熱效果。
The world is in digital era nowadays. Due to the fast development of computer and IC, the speed and performance of the computer chips increases year by year. Consequently, the cooling problems of the electronic components are getting more and more serious.
In the past, the improvements of cooling capability are either increasing the fin area or increasing the flow rate of the fans. However, owing to the trend of compactness in the electronic products, such as desktop or notebook computers, the fin area and the fan size are restricted. The objective of this study is to improve the cooling performance within the limited space inside a personal computer via flow and thermal analysis.
This work is composed of three parts mainly. First, the cooling performance of three kinds of CPU coolers was examined experimentally, which include a square type, a radial type and an upright cooler embedded with heat pipes. The flow and the thermal fields were also studied numerically by using a commercial code FLOTHERM V6.1. Next, the radial type and the upright coolers were cast in a personal computer respectively. The velocity and temperature fields were found and the overall cooling performance was analyzed. Finally, several ways for improving the flow fields as well as the cooling performance were investigated.

The results obtained in this study can be summarized as follows:

(1)Use of copper for the base plate and /or use of heat pipes will enhance the cooling capability of the CPU coolers significantly.

(2)Due to the difference in configuration for between the upright coolers and traditional ones, it is possible to change the locations of inlet/outlet and also to use baffles. The resulting flow field and the cooling capability can be improved.

(3)Baffles can change the cross-sectional area normal to the flow are well as flow fields. Therefore, the temperature inside the computer can be lowered effectively.

(4)It is suggested that the baffles be made of materials of low thermal conductivity. Otherwise, baffles can transfer heat to other places, and therefore increase the temperature of other components.

(5)Proper opening position for the outlet can greatly reduce accumulation of the waste heat and hence cause significant temperature drops for the components.
Relation: 中華民國機械工程學會
URI: http://ntour.ntou.edu.tw/handle/987654321/23929
Appears in Collections:[機械與機電工程學系] 期刊論文

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