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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/23847

Title: Sub-micron-structure machining on silicon by femtosecond laser
Authors: Hung-Yin TSAI;Shao-Wei LUO;Chih-Wei WU;Shing-Hoa WANG
Contributors: NTOU:Department of Mechanical and Mechatronic Engineering
國立臺灣海洋大學:機械與機電工程學系
Keywords: femtosecond laser;SU8;silicon;sub-micron structure
Date: 2009-09
Issue Date: 2011-10-20T08:08:27Z
Publisher: Transactions of Nonferrous Metals Society of China
Abstract: Abstract:Sub-micron-structure machining on silicon substrate was studied by direct writing system of femtosecond laser with the central wavelength of 800 nm, pulse duration of 120 fs and repetition rate of 1 kHz. Three kinds of experiments were conducted: 1) the effect of photoresist on silicon; 2) machinability of different orientations of silicon; and 3) the size of micro-structure and the cross-section shape. Photoresist SU8 was coated onto silicon substrates in thicknesses of 100 μm. SU8 remained on the silicon substrate while the silicon under the machined SU8 was removed after laser machining. Orientations of (100), (110), and (111) silicon substrates were machined with the laser power of 60 μW and the scanning speed of 3 mm/min. Spike morphologies were observed on all three orientations of silicon substrates without obvious directional difference of these spikes on different silicon substrates. In addition, the ablation threshold energies were also similar. In the consideration of ablation energy, one numerical model of the machining parameters has been proposed to simulate the cross-section of the micro-structure. The predicted shape by simulation can fit the profile of the cross-section shape well.
Relation: 19(1), pp.s171–s177
URI: http://ntour.ntou.edu.tw/handle/987654321/23847
Appears in Collections:[機械與機電工程學系] 期刊論文

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