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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/23828

Title: Solid State Bonding of Zr Based and Cu Based BMG
Authors: Shing-Hoa Wang;Pei-Hung Kuo;Peter K. Liaw;Guo-Jiang Fan;Hsiao-Tsung Tsang;Dongchun Qiao;Feng Jiang
Contributors: NTOU:Department of Mechanical and Mechatronic Engineering
Date: 2009
Issue Date: 2011-10-20T08:08:23Z
Publisher: TMS 2009 138th annual Meeting of The Minerals, Metals & Materals Society
URI: http://ntour.ntou.edu.tw/handle/987654321/23828
Appears in Collections:[機械與機電工程學系] 期刊論文

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