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Please use this identifier to cite or link to this item: http://ntour.ntou.edu.tw:8080/ir/handle/987654321/10280

Title: 超平坦硬脆晶圓精密輪磨模擬與拋光技術研發
Ultra-Precision Grinding Simulation and Ultra-Planar Polishing Research on Brittle Wafer
Authors: 蔡宏營
Contributors: NTOU:Department of Mechanical and Mechatronic Engineering
國立臺灣海洋大學:機械與機電工程學系
Date: 2006
Issue Date: 2011-06-28T07:38:19Z
Publisher: 行政院國家科學委員會
Relation: NSC95-2622-E019-004-CC3
URI: http://ntour.ntou.edu.tw/ir/handle/987654321/10280
Appears in Collections:[機械與機電工程學系] 研究計畫

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